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Researchers of Valencia's Polytechnic University (UPV) and the Spanish National Research Council (CSIC) have developed a new methodology that makes it possible to manufacture high-performance circuits for telecommunications in a fast and cheap way. It integrates 3-D printing, which enables the use of metals and polymers. Furthermore, the researchers also suggest a technique that makes it possible to metalize the printed materials and imbue them with conductivity.
"3-D printing allows us to prototype very quickly, but 3-D printing is usually done with plastic materials. As we needed the devices to be conductive in order to use them in microwave applications—circuits—they had to be metalized. And to do so, we have developed a technique that makes it possible to obtain a piece manufactured with a plastic material but with a very...
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